| 发明名称 |
Method for producing metal wirings on an insulating substrate |
| 摘要 |
A method for producing metal wirings on an insulating substrate is disclosed. The method comprises the steps of forming a metal wiring layer of a predetermined shape on a predetermined position of the insulating substrate, the metal wiring layer being made of a metal capable of being oxidized; implanting the metal wiring layer with an impurity element; and forming an insulating layer by oxidizing the surface of the metal wiring layer after implanting the impurity element.
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| 申请公布号 |
US5518936(A) |
申请公布日期 |
1996.05.21 |
| 申请号 |
US19950403125 |
申请日期 |
1995.03.13 |
| 申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
YAMAMOTO, TOMOHIKO;SHIMADA, YASUNORI;MORIMOTO, HIROSHI |
| 分类号 |
G02F1/136;G02F1/1362;G02F1/1365;G02F1/1368;H01L21/265;H01L21/28;H01L21/316;H01L21/3205;H01L21/336;H01L23/52;H01L29/49;H01L29/78;H01L29/786;H01L45/00;H01L49/02;H05K1/03;H05K3/38;(IPC1-7):H01L21/265 |
主分类号 |
G02F1/136 |
| 代理机构 |
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