发明名称 |
POLYAMIDE RESIN COMPOSITION |
摘要 |
PURPOSE: To provide a polyamide resin derived from a specific monomer composition and having excellent heat-resistance and good moldability. CONSTITUTION: This polyamide resin is composed mainly of a polyamide produced from diamines composed of 15-65mol% of p-xylylenediamine and 85-3mol% of m-xylylenediamine and dicarboxylic acids composed of 45-80mol% of a 6-12Cα,ω-aliphatic dicarboxylic acid and 55-20mol% of an aromatic dicarboxylic acid, having a glass transition point (Tg) of 900-130 deg.C (363-403K) and satisfying the formula 0.707<=(tg/Tm)<=0.750 [Tm is melting point; Tg and Tm are expressed by absolute temperature (K)].
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申请公布号 |
JPH08127653(A) |
申请公布日期 |
1996.05.21 |
申请号 |
JP19940263983 |
申请日期 |
1994.10.27 |
申请人 |
MITSUBISHI GAS CHEM CO INC |
发明人 |
INABA YASUO;HARADA MASAHIRO;MORIMOTO KAORU;WATANABE NORIYOSHI |
分类号 |
C08G69/26;C08K3/34;C08L77/00;C08L77/06;(IPC1-7):C08G69/26 |
主分类号 |
C08G69/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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