| 摘要 |
<p>PURPOSE: To provide a method of manufacturing a multilayer printed wiring board, wherein the multilayer printed wiring board is lessened in overall thickness and number of manufacturing processes and enhanced in circuit reliability and production efficiency. CONSTITUTION: A copper foil 8 is bonded to an uppermost insulating board 1u for the formation of a laminate 10 covered with a lid 9, a through-hole 3 is provided in the laminate 10 and plated, and then an outermost circuit is provided in the laminate 10. The lid 9 is electrically isolated, then an opening smaller than a prescribed opening is bored rough in it by machining, the residue 9a of the lid 9 is left unremoved, a conductor protecting layer 28 of metal smaller in etching rate than copper is formed on the exposed surface of a conductor circuit 4 by electroplating, and then the residue 9a is removed by etching, and a housing hole 2 is bored.</p> |
