| 摘要 |
PURPOSE: To remarkably improve solderability of I/O terminals of a semiconductor chip, adhesion to a board, and bonding quality, directly mount a semiconductor chip on the board by wireless bonding without forming solder bumps, and in particular, mount a semiconductor chip on a board with high adhesion in a repair process. CONSTITUTION: The I/O terminal of a semiconductor chip is constituted of a base material metal layer 2 like aluminum, and a nickel alloy thin layer 3 and a noble metal thin layer 4 which are laminated in order on the layer 2. As the nickel alloy thin layer 3, an alloy layer wherein Ni is used as the main component, and at least one kind out of Cu, Mn, Mg, Cr Si, W, Au, Ti and V is contained is formed by electroless plating. After the nickel alloy thin layer 3 and the noble metal thin layer 4 are laminated on the base material metal layer 2 of the I/O terminal, the interfacial adhesion of layers is improved by heat treatment. |
