| 摘要 |
PURPOSE: To form an adequate loop configuration wherein a wire scarcely hangs down, by forming a protruding part against which a bent wire abuts and is repelled when a wire is stretched, in the vicinity of a bonding point. CONSTITUTION: By using a capillary 36, a spherical part of a tip of a wire 16 is connected with a first bonding point as the electrode of a semiconductor chip, by an ultrasonic thermo-compression bonding. The capillary 36 sequentially moves to the second bonding side. Just before a warping part 54 of the wire 16 abuts against a protruding part 50, the wire is apt to hang down. By making the warping part 54 abut against the slant surface of the protruding part 50, the warping part is repelled because the collosion part is a slant surface. As the result, the rising angle of a wire neck part 55 becomes large. Thereby the wire is made hard to hang down when the distance between the first bonding point and the second bonding point is increased. |
