| 摘要 |
<p>PURPOSE: To prevent prepreg from protruding into a recess by a method wherein an insulating board provided with a through-hole in which a sealing material is fitted and another insulating board are laminated together and pressed into an electronic part mounting board of integral structure provided with the recess, and the sealing material is removed from the recess. CONSTITUTION: An insulating board 21a where a conductive layer 11a is formed is laminated on an insulating board 2a provided with a circuit 101a through the intermediary of a prepreg 3a, wherein a through-hole provided to the insulating board 2a is made to serve as a recess 41a. A sealing material 7 of solidified epoxy resin is fitted in the recess 41a. The insulating board 2a provided with the through-hole where the sealing material 7 is fitted and the insulating board 21a are formed into one piece by pressing. After a pressing process, the sealing material 7 is removed from the recess 41a. By this setup, the prepreg 3a is prevented from protruding into the recess 41a, and the recess 41a is capable of being improved in accuracy.</p> |
