发明名称 |
Fabrication processes for monolithic electronic modules |
摘要 |
This invention comprises various high production methods for simultaneously forming surface metallizations on a plurality of monolithic electronic modules. Each monolithic electronic module may comprise a single semiconductor chip or multiple semiconductor chips. The methods can employ a workpiece which automatically discontinues side surface metallization between different electronic modules in the stack. Multiple workpieces are interleaved within the stack between the electronic modules. Each workpiece may include a transfer layer(s) for permanent bonding to an end surface of an adjacent electronic module in the stack. This transfer layer may comprise an insulation layer, a metallization layer, an active circuit layer, or any combination thereof. End surface metallization can thus be provided contemporaneous with side surface metallization of multiple electronic modules.
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申请公布号 |
US5517754(A) |
申请公布日期 |
1996.05.21 |
申请号 |
US19940252794 |
申请日期 |
1994.06.02 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BEILSTEIN, JR., KENNETH E.;BERTIN, CLAUDE L.;HOWELL, WAYNE J. |
分类号 |
H01L21/28;H01L21/98;H01L25/065;(IPC1-7):H05K3/34 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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