| 摘要 |
PURPOSE: To eliminate the unfilled position of resin and to improve the yield by realizing a lead frame of the shape which does not disturb the flowability of resin in a resin molding step in a semiconductor device sealed by resin molding by connecting the wirings of an integrated circuit board to a lead terminal. CONSTITUTION: A lead terminal 23 has adjacent two lead parts (handgrips) 23b at the sites of adjacent leads of the same potential, and a commonly used fixing piece 23a coupled to the ends. A slit 23e between the leads is cut out and formed between the pad down shape hanging bent parts 23d. In the step of resin molding by transfer mold, the parts 23d are not coupled, do not become a barrier for the flow of the resin, but smoothly flow via the slit 23d between the leads. Thus, the spreading of the resin becomes sufficient, the unfilled part of the resin is eliminated, and the occurrence rate of external appearance failure can be reduced. |
