| 摘要 |
PURPOSE: To provide a highly reliable and low-cost semiconductor sensor by turning a package molded of plastic not influenced by the static electricity or not accompanying the deformation of plastic into practical use. CONSTITUTION: A sensor package 1 is formed of an integral plastic 13 which is press-molded from a thin plate. A mounting part-reinforcing plate 2, a chip tab 3, input/output terminals 6, an adjusting terminal 7, etc., are set inside the sensor package 1. An acceleration detection element 4 and a special IC chip 5 are securely fixed onto the chip tab 3 and connected to each terminal by a bonding wire 10. In order to prevent outer disturbances by the static electricity, an overhang part 18 is formed in the sensor package 1. A part of an end face 8 of the package 1 projects outside from the adjusting terminal 7 to surround the adjusting terminal 7 at the overhang part 18. If there are a plurality of adjusting terminals 7, the overhang parts 18 and adjusting terminals 7 are arranged alternately. |
