| 摘要 |
PURPOSE: To provide a semiconductor device which transmits heat from a semiconductor element directly to a radiating component by reducing the thermal resistance value of a semiconductor device in order to radiate the heat generated from the device itself out of the device. CONSTITUTION: A semiconductor element 11 and a radiating component 13 surrounding the outer periphery of the element are mounted at a radiating component 12 as a die pad, and inner leads 15 are bonded to the element via fine wires 16. Then, a radiating component 14 mounted at the wiring pattern forming surface side of the element is mounted to form a package 17. Thus, the thermal resistance of a semiconductor device is reduced by mounting the radiating components on the periphery of the element, and the heat is transmitted from the element directly to the radiating components, thereby improving the radiating properties of the device. |
