MANUFACTURE OF PRINTED CIRCUIT BOARD

摘要

PURPOSE: To manufacture a printed circuit board which can package wirings of higher density by a simple process with high reliability by high yield. CONSTITUTION: The method for manufacturing a printed circuit board comprises the steps of extruding or dropping melted conductor on a predetermined region surface of a sheetlike or platelike support base material 3, then solidifying to form protruding conductive bump 5 group, sequentially superposing to laminate a synthetic resin sheet 6 and a conductive metal layer 3' on the surface formed with the bump 5 group, and pressurizing the laminate to pass the end of the bump 5 group in the thickness direction of the sheet 6 to connect it to the layer 3'.