| 摘要 |
<p>PURPOSE: To electrically connect a semiconductor integrated circuit chip to be contained inside an insulation container to an external electric circuit reliably and firmly by fixing a projection-like terminal of a small conduction resistance to the bottom of an insulation container which contains a semiconductor integrated circuit chip. CONSTITUTION: The title package for containing a semiconductor chip is formed by applying a projection-like terminal 7 to be connected to each electrode of a semiconductor chip 3 to the bottom of an insulation container 4 with a space for containing the semiconductor chip 3 inside. The projection-like terminal 7 is made of 50.0 to 66.0wt.% of metal powder of an average grain diameter of 3.0 to 4.0μm and 34.0 to 50.0wt.% of glass powder of an average grain diameter of 0.5 to 1.0μm.</p> |
