SEMICONDUCTOR DEVICE AND PRODUCTION THEREOF

摘要

PURPOSE: To produce a cumulatively bonded semiconductor device having high bonding strength while decreasing the number of production steps. CONSTITUTION: A first electrode 11 and an insulation film 12 therefor are formed on the surface of a first semiconductor substrate 10. A second electrode 14 and an insulation film 15 therefor are then formed on the surface of a second semiconductor substrate 13. An irregular pattern having saw-tooth cross-section is formed in stripe at a predetermined period on the surface of the first substrate 10 while an irregular saw-tooth pattern, having phase shifted by 180 deg. from that of the first semiconductor substrate 10, is formed in stripe on the surface of the second semiconductor substrate 13. First and second semiconductor substrates 10, 13 are bonded with the irregularities on the surface mating each other.