发明名称 CIRCUIT SUBSTRATE WITH CAPACITOR AND MULTILAYER CIRCUIT SUBSTRATE WHEREIN THE CIRCUIT SUBSTRATE IS USED
摘要 <p>PURPOSE: To provide a circuit substrate with a print capacitor which enables an increase in capacity of a print capacitor formed on a printed substrate. CONSTITUTION: A copper clad lamination board 1 is used as an insulation substrate. A first electrode 2a of a print capacitor 3 is formed of cooper foil on a surface of a copper clad lamination board. A dielectric layer 4a is formed on the first electrode 2a by using dielectric paste and a second electrode 5a is formed on the dielectric layer 4a by using conductive paint.</p>
申请公布号 JPH08125302(A) 申请公布日期 1996.05.17
申请号 JP19940255252 申请日期 1994.10.20
申请人 HOKURIKU ELECTRIC IND CO LTD 发明人 ISHIYAMA ICHIRO;NAGARE ICHIRO;KUROKAWA HIROYUKI;KATO MASAKI;AZUMA KOJI;NOMURA KAZUO;NAKANUMA NOBUTSUGU
分类号 H05K1/16;H05K3/46;(IPC1-7):H05K1/16 主分类号 H05K1/16
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