发明名称 |
CIRCUIT SUBSTRATE WITH CAPACITOR AND MULTILAYER CIRCUIT SUBSTRATE WHEREIN THE CIRCUIT SUBSTRATE IS USED |
摘要 |
<p>PURPOSE: To provide a circuit substrate with a print capacitor which enables an increase in capacity of a print capacitor formed on a printed substrate. CONSTITUTION: A copper clad lamination board 1 is used as an insulation substrate. A first electrode 2a of a print capacitor 3 is formed of cooper foil on a surface of a copper clad lamination board. A dielectric layer 4a is formed on the first electrode 2a by using dielectric paste and a second electrode 5a is formed on the dielectric layer 4a by using conductive paint.</p> |
申请公布号 |
JPH08125302(A) |
申请公布日期 |
1996.05.17 |
申请号 |
JP19940255252 |
申请日期 |
1994.10.20 |
申请人 |
HOKURIKU ELECTRIC IND CO LTD |
发明人 |
ISHIYAMA ICHIRO;NAGARE ICHIRO;KUROKAWA HIROYUKI;KATO MASAKI;AZUMA KOJI;NOMURA KAZUO;NAKANUMA NOBUTSUGU |
分类号 |
H05K1/16;H05K3/46;(IPC1-7):H05K1/16 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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