| 摘要 |
PURPOSE: To obtain a thin film multilayered wiring board of high density, by constituting a wiring connection post as an unified structure member with a lower wiring, and making the wiring connection post narrower than or equal to the lower wiring. CONSTITUTION: Wiring connection posts 18c, 18d for connecting an upper wiring with lower wirings 18a, 18b are constituted as unified structure members with the lower wirings 18a, 18b. The wiring connection posts 18c, 18d are narrower than or equal to the width W1 of the lower wirings 18a, 18b. As a result, the occupied area of the parts for connecting the upper wiring with the lower wirings 18a, 18b can be reduced by the area equivalent to large viaposts which are not necessary to be formed. Further, rounds for allowing the alignment error between the lower wirings 18a, 18b and the viaposts are unnecessary, so that the occupied area of the parts for connecting the lower wirings 18a, 18b with the wiring connection posts 18c, 18d can be reduced. Hence a thin film multilayered wiring board 10 of high density is obtained. |
