POWER SEMICONDUCTOR MODULE

摘要

PURPOSE: To prevent accident when a power semiconductor module, mounting a power semiconductor chip in one module, is connected with external wiring. CONSTITUTION: Power semiconductor chips 2, 3 are mounted on the upper surface of a copper foil circuit formed on a metal board 1 through an insulation layer. The semiconductor chips 2, 3 are surrounded by a resin case 4 into which a protective material is injected and cured. The resin case is provided with a terminal having one end extending to the copper foil circuit on the metal board and the other end insert molded to the terminal lead-out part at the end of the resin case.