| 摘要 |
PURPOSE: To provide the heat sink mounting structure for a semiconductor device in which the operating steps can be, the manufacturing efficiency is improved, and the manufacturing cost can be curtailed. CONSTITUTION: A mounting structure mounts a heat sink 4 at a semiconductor device 11 in which a frame 3 is molded with a resin molded form 12, integrally forms a connecting pin 15 at the device 11, and integrally forms a hole 4a engaged with the pin 15 with the heat sink 4. |
