| 摘要 |
PURPOSE: To sufficiently obtain the joint strength. CONSTITUTION: A solder sheet 22 is transferred to the connecting electrode 7 of a printed circuit board 4 by thermally press bonding, the outer lead 5 of a TAB tape 3 is superposed on the electrode 7 of the board 4 via the sheet 22, and thermally press bonded from above the outer lead 5 of the tape 3 by using a thermally press bonding head 12 thereby to connect the electrode 7 of the board 4 to the outer lead 5 of the tape 3 via the sheet 22. In this case, if the sheet 22 is formed in a suitable thickness, the outer lead 5 of the tape 3 can be so formed to sufficiently increase the joint part 9 as to be buried by the joint part 23 with the result that the sufficient connecting strength can be obtained. |
