| 摘要 |
<p>PURPOSE: To provide a method of easily and safely wire-bonding a sheet-like circuit material of high bonding quality even if a flexible printed circuit board is very thin. CONSTITUTION: A sheet-like circuit material 1 is bonded to a pad 3 with a thermally peelable adhesive tape 4 which deteriorates in adhesive force by heating, then an element 2 is bonded to the sheet-like circuit material 1 with a wire through an ultrasonic pressure-bonding method, then the thermally peelable adhesive tape 4 is lessened in adhesive force by heating, and then the sheet-like circuit material 1 is dismounted from the pad 3.</p> |
