发明名称 METAL WIRING BOARD, SEMICONDUCTOR DEVICE AND THEIR MANUFACTURE
摘要 <p>PURPOSE: To excellently mutually connect the first and the second metal layer without executing the treatment of etching or the like to the anodized part of the first metal layer. CONSTITUTION: The first and the second metal layer 2, 3 composed of Al are provided on a glass substrate 1, and an anodized part 5 and a nonanodized part 6 are formed in the first metal layer 2, and the second metal layer 3 is connected to the first metal layer 2 through the nonanodized part 6, which is smaller than the width of the first metal layer 2, and formed so that its outer periphery is surrounded by the anodized part 6, and the anodized part 5 is formed so as to cover the whole surface of the first metal layer 2 except the nonanodized part 6.</p>
申请公布号 JPH08122818(A) 申请公布日期 1996.05.17
申请号 JP19940258428 申请日期 1994.10.24
申请人 SHARP CORP 发明人 GOTO MASAHITO;HAMADA TOSHIMASA;TANAKA HIROHISA
分类号 G02F1/136;G02F1/1368;H01L21/768;H01L23/52;H01L23/522;H01L23/538;H01L27/12;H01L29/786;(IPC1-7):G02F1/136 主分类号 G02F1/136
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