| 摘要 |
<p>PURPOSE: To form the connecting electrode of Cu with high strength by simple steps by printing conductor pad of Cu having larger diameter than a predetermined electrode diameter in the case of forming the electrode, and by forming glass ceramic cover coating at the periphery by printing. CONSTITUTION: Glass ceramics are used as a board material, and Cu is used as a conductor material. A through hole 12 and a conductor pattern 13 are printed on a green sheet 11, and printed green sheet necessary to form a predetermined circuit is prepared. A conductor pad 14 of Cu larger than a predetermined electrode diameter is printed, and press-bonded as a laminate printed with cover coating glass ceramics 15 on the periphery. Thereafter, a protective film is formed on the Cu conductor pad on the ceramics sintered at the entirety by plating as required. Thus, Cu connecting electrode having high strength can be formed by simple steps. Since the connecting electrode is formed simultaneously upon sintering of the board, the steps can be simplified.</p> |
