MOUNTING STRUCTURE FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: To provide the mounting structure for a semiconductor package in which the crack of solder for connecting the lead terminal of the package to the connecting terminal of a printed board based on thermal expansion can be prevented. CONSTITUTION: The mounting structure for a semiconductor package divides the end of a suspended lead terminal 1 to rectangular terminals 2, soldering 5 at least one of the terminals 2 to the connecting terminal 4 of a printed board 3, inserting at least one of the other terminal 2 to the through hole 5 of the board 3, and soldering 5 it.