| 摘要 |
<p>PURPOSE: To reduce heat conduction loss from a conductive heating member to a substrate, relating to a thermal type flaw rate detecting element which detects fluid flow rate based an heat transfer quantity from the conductive heating member to the fluid. CONSTITUTION: A conductive heating member 16 is buried in insulating materials 12 and 13, and, a semiconductor substrate 10 facing the conductive heating member 16 with a recessed part 20 in between is provided with the second conductive heating member 17. And further, the area of second conductive heating member 17 is made equal to or larger than the conductive heating member 16. And, the temperature of second conductive heating member 17 is made equal to the conductive heating member 16, or their temperature difference is made constant. And, the recessed part provided on a part of the surface of the semiconductor substrate 10 is made vacuum.</p> |
