MANUFACTURE OF MULTILAYER PRINTED CIRCUIT BOARD

摘要

PURPOSE: To reduce the cost by simplifying the steps of laminating a multilayer laminated board. CONSTITUTION: A multilayer laminated board is obtained by so coating the entire surface of an insulating board 1 formed with a conductor pattern 3 with a printed circuit board made of at least first layer conductor pattern and an insulating board as an inner layer board is so coated of adhesive material 4 made of insulating resin as to cover the pattern 3, temporarily drying it, then continuously adhering a copper foil 5 previously coated with adhesive 5a by a heating and pressurizing roller, laminating it and further thermally curing it.