发明名称 SMALL-SIZED LOW TEMPERATURE DEVICE
摘要 PURPOSE: To apply reduction in size and easy maintenance to civilian equipment and apply it in many fields by holding in vacuum a heat insulation chamber formed by a cooling stage, a flange, an outer frame, etc. CONSTITUTION: Aluminum to become a shielding layer 8 is vapor deposited on the inner surface of a cylindrical outer frame 7 made of quartz glass. Then, the connecting part of the frame 7 to a flange 5 is coated with Pb-Sn alloy added with Zn, etc., by plasma spraying to form a welded layer 6. Thereafter, a low temperature device 2 is connected to a cooling stage 1 via an adhesive layer 3 made of In-Ga, the device 2, lead wires 9, and a connector 10 are connected, filled together with the frame in a vacuum chamber, and evacuated in vacuum. Thereafter, the frame 7 is connected to the flange 5 in the chamber, the layer 6 is heated to weld the frame 7 to the flange 5. Thus, the periphery of the device 2 is maintained in high vacuum to provide heat insulating function.
申请公布号 JPH08121890(A) 申请公布日期 1996.05.17
申请号 JP19940260645 申请日期 1994.10.25
申请人 SEIKO EPSON CORP 发明人 NATORI EIJI;KAMIKAWA TAKETOMI;IWASHITA SETSUYA
分类号 F25B9/00;F25B9/14;H01L23/34;(IPC1-7):F25B9/00 主分类号 F25B9/00
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