| 摘要 |
<p>PURPOSE: To obtain an efficient, ultra-compact, and inexpensive photocoupler by joining transparent insulation resin and opaque insulation resin without any interface. CONSTITUTION: A method of manufacturing a photocoupler comprises a process for die-bonding a light emitting element 3 and a photodetector 4 to individual metal lead frames 1 and 2 and laying out the light-emitting element 3 and the photodetector 4 opposingly so that they can be optically coupled and a process for forming a light path between the light-emitting element 3 and the photodetector 4 by performing transfer formation with transparent epoxy resin 5 while the elements 3 and 4 are laid out opposingly. It also is provided with a process for laid out them in a plasma container 11, generating plasma, and performing plasma ashing treatment to the surface of the transparent epoxy resin 5 and a process for performing transfer formation of the outer-periphery part of the transparent epoxy resin 5 with an opaque epoxy resin 6.</p> |
