| 摘要 |
<p>PURPOSE: To provide a dicing apparatus capable of correcting displacement automatically by enabling detection of cutting position displacement for a wafer without cutting it and by enabling automatic measurement of displacement amount itself. CONSTITUTION: A reference point is provided on a wafer-table base 13 integral with a wafer table 10. A sensor 38 for measuring a distance to a blade 18 and a measuring apparatus 40 for measuring a position relation between the reference point 36 and the sensor 38 are provided in a blade cover 30 of a blade 10, which blade is mounted on the tip of a spinning spindle 20 and is index-fed in the Y-direction by a blade-indexing apparatus 24 on the basis of a scale 26. The distance to the blade 18 is measured by the sensor 38 in a state where correlation between wafer-table coordinates and the scale 26 is formed by the measurement with the measuring apparatus 40, and the amount of the displacement of the blade 18 from a normal position due to elongation of the spindle 20, etc., is detected as a variation of the distance measured by the sensor 38.</p> |
