发明名称 METHOD FOR BRAKING SEMICONDUCTOR WAFER AND ITS DEVICE
摘要 <p>PURPOSE: To favorably and readily divide a semiconductor wafer each pellet. CONSTITUTION: Pinions 18 are fixed to both sides of a braking roller 21 and a weight 22 is abutted against an upper side of the braking roller 21 and a rack 23 fixed to both sides of the weight 22 engages with the pinions 18 of the braking roller 21. As the pinions 18 engaging with the rack 23 is rotated corresponding to straight movements of the weight 22, the braking roller 21 is compulsorily rotated. As the braking roller 21 is accurately rotated without laterally sliding against a semiconductor wafer 1, the semiconductor wafer 1 is favorably divided each pellet along a braking preliminary line.</p>
申请公布号 JPH08124883(A) 申请公布日期 1996.05.17
申请号 JP19940282605 申请日期 1994.10.20
申请人 HITACHI LTD;HITACHI SHONAN DENSHI CO LTD 发明人 ARAI SHIGERU;UEKURI TORU;NAKAJIMA MAKOTO;TAKANO EIJI
分类号 B28D5/00;H01L21/301;(IPC1-7):H01L21/301 主分类号 B28D5/00
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