发明名称 |
Packaging electrical circuits |
摘要 |
A method is described for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces. The method further includes reflowing solder within the gap. A structure is described including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device. A method for use in making a package for electrical circuits includes attaching an electrical insulator within a recess of a first metallic component. The method also includes registering a second metallic component within the recess using a template tool and bonding the second metallic component to the insulator. A third component is soldered to the second metallic component. A structure is disclosed including an electrical conductor and a sheet of conductive material including a punt soldered to the electrical conductor. <IMAGE> |
申请公布号 |
EP0712153(A2) |
申请公布日期 |
1996.05.15 |
申请号 |
EP19950308057 |
申请日期 |
1995.11.10 |
申请人 |
VLT CORPORATION |
发明人 |
VINCIARELLI, PATRIZIO;BELLAND, ROBERT E.;EAD, GEORGE J.;FINNEMORE, FRED M.;ANDRUSS, LANCE L. |
分类号 |
H05K3/34;H01L21/58;H01L21/60;H01L23/06;H01L23/36;H01L23/373;H01L23/498;H01L23/552;H01L23/58;H01L23/62;H05K9/00 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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