发明名称 SHADOW CLAMP
摘要 A wafer clamping member for clamping a wafer in a plasma reaction chamber. The clamping member has a design which minimizes particle contamination of the wafer and allows more wafers to be processed before it is necessary to clean built-up deposits from the clamping member. The clamping member includes a clamping portion which clamps an outer periphery of the wafer against a bottom electrode and a shadow portion which provides a gap between an inner edge of the clamping member and the upper surface of the wafer. The gap is open to the interior of the plasma reaction chamber and preferably has a height equal to about a mean free path of a gas activated to form a plasma in the plasma reaction chamber.
申请公布号 EP0711455(A1) 申请公布日期 1996.05.15
申请号 EP19940922752 申请日期 1994.07.26
申请人 LAM RESEARCH CORPORATION 发明人 LENZ, ERIC, HOWARD;BRUMBACH, HENRY
分类号 C23F4/00;C23C16/458;H01L21/00;H01L21/302;H01L21/3065;H01L21/683;H01L21/687 主分类号 C23F4/00
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