| 发明名称 |
VERFAHREN ZUM HERSTELLEN EINES UNIAXIAL ELEKTRISCH LEITENDEN ARTIKELS |
| 摘要 |
Miscellaneous UNIAX concepts. The present concepts include "1:1" uniax (40) with one conductive through-hole per chip connection site, "mirror chip" testing, heat-sink bonding to chips, avoiding contact with conductive cleaved edge of chip, indium solid columns, metal recessed (41) in the through-holes. All of these are subject to preferred materials (UPILEX polyimide) and techniques (U.V. laser ablation, minimum taper of holes). |
| 申请公布号 |
AT137064(T) |
申请公布日期 |
1996.05.15 |
| 申请号 |
AT19890301106T |
申请日期 |
1989.02.03 |
| 申请人 |
RAYCHEM LIMITED |
发明人 |
LUDDEN, MICHAEL JOSEPH;SMITH, NICHOLAS J. G.;GIBNEY, PAUL JAMES;NYHOLM, PETER |
| 分类号 |
H01L21/60;B23K1/00;B23K20/02;B23K26/40;B23K31/02;H01L21/48;H01L21/66;H01L23/14;H01L23/373;H01L23/498;H05K1/03;H05K3/00 |
主分类号 |
H01L21/60 |
| 代理机构 |
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