Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung.
摘要
<p>Flexible multilayer polyimide metal-clad laminates, and their preparation, having at least one layer of aromatic polyimide bonded to at least one layer of a metallic substrate using a heat-sealable copolyimide adhesive containing repeating imide units derived from 4,4'-oxydiphthalic dianhydride and an aromatic ether diamine. The laminates are used in flexible printed circuits and tape automated bonding applications. Additionally, the metallic substrate may be directly coated with the copolyimide adhesive and used as a single-clad laminate for flexible printed circuits.</p>
申请公布号
DE69115171(T2)
申请公布日期
1996.05.15
申请号
DE1991615171T
申请日期
1991.08.23
申请人
E.I. DU PONT DE NEMOURS & CO., WILMINGTON, DEL., US
发明人
KANAKARAJAN, KUPPUSAMY, DUBLIN, OHIO 43017, US;KREUZ, JOHN ANTHONY, COLUMBUS, OHIO 43220, US