发明名称 CONSTRUCTION FOR MULTILAYER WIRING
摘要 PURPOSE:To prevent the short circuit between wiring layers by avoiding exposure fog at photoengraving and to increase the degree of integration, by shifting the edge of the second wiring layer formed along the edge of the first wiring layer among a plurality of second wiring layers from the circumference of the first wiring layer by a given size.
申请公布号 JPS53127286(A) 申请公布日期 1978.11.07
申请号 JP19770042899 申请日期 1977.04.13
申请人 发明人
分类号 H05K3/46;H01L21/3205;H01L23/52;H05K1/00 主分类号 H05K3/46
代理机构 代理人
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