Verfahren zum Montieren einer Wärmesenke auf einer Pluralität von Halbleiterbauelementgehäuse.

摘要

A Single-In-Line molded resin package (1) for a medium-power semiconductor device destined to receive an external heat sink (7) mounted thereon is provided with one or more parallel open ended slots (4, 5), perpendicular to the coupling face (8) with the heat sink and open on the side of the package opposite to the side from which the pins (2) projects. The stems of the fastening screws (12) which may be conveniently pre-arranged on the coupling face of the heat sink are slidingly received in the respective open ended slots or notches of the various devices aligned on the printed circuit card (6) thus simplifying the assembly operations and making them more compatible to automation.