Verfahren zum Manipulieren von Mikrobauteilen und Vorrichtung zur Durchführung des Verfahrens

摘要

Described is a process for manipulating microcomponents or other lightweight components wherein a gripper, using adhesives applied between gripper surface and component, removes the latter from a magazine or the like and deposits it at a point of destination. To do this the gripper is positioned horizontally over the component and an adhesive is applied to the gripper surface. Gripper and component are then brought together far enough that the area between them is completely wetted. The amount of liquid between gripper surface and component can then be reduced as needed until an optimal adhesive force has been attained. The gripper with component is then moved to an assembly station and the aligned component is released, optionally following appropriate fixation. At the end of the joining operation the gripper is then lifted off the component and returned to its starting position.