Verfahren zum laserunterstützten Plattieren von Band und dessen Anwendung

摘要

Process for joining strips and/or plates of metallic materials. The strips/plates are fed at an angle to each other into an aperture for joining. Just before they make physical contact, the surfaces to be joined are heated, but not melted, with a laser beam. This is directly followed by a pass in which the strips/plates are pressed together with the result that their material surfaces brought into contact are firmly bonded.