Verfahren zum Plazieren einer elektronischen Komponente und seiner elektronsichen Verbindungen auf einer Unterlage

摘要

Method of positioning an electronic component (35) and its electrical connections on a support (20) provided with a cavity (21) for accommodating the said component. …According to the invention a metal layer (22) is partitioned into zones (32) on which is deposited a polyimide layer (34) which mechanically holds the said zones during the operations of electrical connection of the electronic component (35) and of encapsulation and positioning on the support. This method avoids the use of a support film and of adhesive for fixing the metal zones onto film, elements which do not withstand high temperatures during encapsulation. …The invention is applicable in particular to memory cards. ……