| 摘要 |
PURPOSE: To provide a molding device for electronic parts capable of minimizing an influence exerted on a product by stress generated in cutting a burr of a dam. CONSTITUTION: A lead frame 1 on which electronic part elements are mounted are sandwiched between top and bottom forces 10, 11, and peripheries of the electric part elements are molded from a resin. A burr of a dam is formed by making the resin flow in a hollow part 1b around a lead terminal of the lead frame in molding. A projected wall part 12, wherein that is arranged in the hollow part 1b, its height is lower than a sheet thickness of the lead frame and its inside wall surface composes a part of a cavity for the resin molded part 3, is formed in either of a top or bottom force. Therefore, a thin wall thickness part 4a is formed in a border part of the burr of the dam 4 on the resin molded part, and cutting of the burr of the dam 4 becomes easy. |
