FORMATION OF FILM PATTERN BY LIFTING-OFF

摘要

PURPOSE: To make it possible to form beautiful film patterns of a cross- sectionally rectangular shape by lifting-off. CONSTITUTION: The resist patterns 32 for lifting-off having an inverted taper shape are formed on a substrate 30 and a metallic film 38 is deposited by evaporation on the substrate in such a manner that evaporated particles are made incident on the substrate surface at an incident angle of nearly 90 deg. therewith in a vacuum chamber. This method for forming the film patterns by lifting-off comprises removing the resist patterns 32 and the film material 38 formed thereon by a lifting-off operation after the vapor deposition described above. A positive type resist of an image reverse type is used in formation of the resist patterns 32 for the lifting off of the inverted taper shape. A dome type vapor deposition jig having a spherical surface shape is used and the many substrates are disposed on the inside surfaces thereof. An evaporating source is installed at the spherical surface center of the dome type vapor deposition jig and the vapor deposition is executed by driving the dome type vapor deposition jig to make rotation alone.