发明名称 |
Additive structure and method for testing semiconductor wire bond dies |
摘要 |
A structure and method for achieving burn-in and full functional testing of a semiconductor wire bond die are provided. The structure comprises an electrical conductor which connects a wire bond pad to a solderable test contact laterally displaced from the wire bond pad. The solderable test contact is configured to facilitate electrical connection of an external testing device thereto for electrical testing and/or burn-in of integrated circuitry associated with the die, without direct physical contact to the wire bond pads. The structure does not need to be removed following the burn-in or test. |
申请公布号 |
US5517127(A) |
申请公布日期 |
1996.05.14 |
申请号 |
US19950370278 |
申请日期 |
1995.01.09 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BERGERON, RICHARD J.;LAMOTHE, THOMAS J.;SUAREZ, JOSEPH E.;THOMPSON, JOHN A. |
分类号 |
G01R3/00;G01R31/28;H01L23/528;H01L23/58;(IPC1-7):C23C26/00;H01L29/44;H01L23/48 |
主分类号 |
G01R3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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