A LEADFRAME FOR AN INTEGRATED CIRCUIT PACKAGE WHICH ELECTRICALLY INTERCONNECTS MULTIPLE INTEGRATED CIRCUIT DIE

摘要

A leadframe (72) for use in an integrated circuit package (70) including at least one integrated circuit die (74) attached to the leadframe (72) and an encapsulant material (82) surrounding the die (74) and portions of the leadframe (72) is herein disclosed. The leadframe (72) includes a central portion (90) having a plurality of perforations (100) through the central portion (90) adapted to allow the flow of the encapsulant material through the perforations (100) during the molding process of the manufacture of the integrated circuit package (70) thereby (i) preventing the flow of the encapsulant material from shifting the die attach pad (94) during the manufacture of the package (70) and (ii) providing anchoring for the encapsulant material to the leadframe (72) to prevent delamination and cracking of the package (70). In one embodiment of the present invention, the perforations (100) in the central portion (90) of the leadframe (72) are diagonal perforations (100) forming therebetween diagonal electrically conductive strips (102) electrically isolated from one another and each of which is continuous with at least one of the electrically conductive leads in the peripheral portion of the leadframe. The electrically conductive strips (102) are adapted to provide means for electrically interconnecting a first (74) and a second integrated circuit memory die (78) attached to the top and the bottom side of the die attach pad segment (94) of the leadframe (72). In accordance with another feature of the present invention, the electrically conductive strips (102) and their associated electrically conductive leads are adapted to provide thermal conduction paths through each of the leads for the integrated circuit die (74, 78) when the die is attached to the die attach pad segment (94) of the central portion (90) of the leadframe (72).