| 摘要 |
<p>A novel flux formulation for the assembly of electronic circuit boards having a conformal coating comprises: (1) a solvent, pref. water; (2) a water-soluble weak organic acid, pref. adipic acid; (3) a halide-free non-ionic surfactant, pref. an alcohol ethoxylate; and (4) a biocidal co-solvent, pref. isopropanol. The formulation is compatible with the cpd. coating, allows the elimination of post-soldering cleaning and emits no volatile organic cpds. during fluxing and soldering. Also claimed is a method for soldering which comprises: (i) heating the components to be soldered to a suitable temp.; and (ii) applying to the surface to be soldered, solder and the disclosed flux.</p> |
