| 摘要 |
An automatic wafer (W) lapping apparatus (1) including: a lapping assembly (A) consisting of an upper lapping plate, a lower lapping plate and wafer carriers (7); a loader assembly (B) installed in the vicinity of the lapping assembly; an unloader assembly (C) installed in the vicinity of the lapping assembly; and a robot (D) having wafer holder member (26) for holding a plurality of wafers (W) and for transferring the wafers between the loader assembly and the unloader assembly and the lapping assembly, WHEREIN the wafer lapping assembly further includes a position sensor (9) for detecting the position of the carriers (7) and a device (33) for cleaning the wafer holder, and the robot (D) consists of a single-handed arm (25) and the wafer holder (26) supported at the fore end of the arm of the robot which can hold wafers (W) one by one. <IMAGE> |
