发明名称 |
Electrostatic discharge protection device |
摘要 |
An electrostatic discharge protection device (12) may be fabricated below a wirebond pad (20) to reduce the area impact upon the circuit (10) which incorporates the device. The electrostatic discharge protection device has one or more diodes (13) formed below the wirebond pad. The connections to and from the diodes are by a one or more sets of strips (46). The silicon dioxide formed in the gaps between the strips transfers the downward force exerted during wirebonding to the substrate with causing interlayer delamination.
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申请公布号 |
US5514892(A) |
申请公布日期 |
1996.05.07 |
申请号 |
US19940315727 |
申请日期 |
1994.09.30 |
申请人 |
MOTOROLA, INC. |
发明人 |
COUNTRYMAN, ROGER;GEROSA, GIANFRANCO;MENDEZ, HORACIO |
分类号 |
H01L27/02;(IPC1-7):H01L27/04;H01L29/861 |
主分类号 |
H01L27/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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