| 摘要 |
<p>PURPOSE: To reduce the total thickness of an apparatus for mounting electronic parts by joining copper foils to the surface of the top insulating sheet and to the underside of the lowermost insulating sheet to close the opening of the housing hole in the laminate. CONSTITUTION: An upper copper foil 8u is joined to the top of an insulating sheet 1u at the highest portion and a lower copper foil 8d is joined to the bottom of an insulating substrate 1d at the lowest portion at the same time as the compression bonding or joined after the compression bonding. And the upper opening 6u is covered with an upper lid 9u including the upper copper foil 8u, and a lower opening 6d is an laminated body 10 covered with a lower lid 9d containing lower copper foil 8d. A through hole 3 is made in this laminated body 10, plating is applied to this through hole 3, then the upper lid 9u and the lower lid 9d are removed by mechanical processing, and the storage hole 2 is opened. Next, a heat radiating plate 1h having an electronic part mounting portion 5 is joined to the bottom of an insulation sheet 1d at the highest portion and then an end portion of a radiator plate 1h is soldered and attached so as to close the lower opening 6d.</p> |
