| 摘要 |
PURPOSE: To improve the heat radiation and humidity resistance of a semiconductor device. CONSTITUTION: A resin sealing material 18, and the upper surface of a header part 11 of a heat radiating material 10 are covered with a high heat-conductive material 20 that comprises a high heat-coductive metal material sheet such as of Cu, with an adhesive layer made of a high heat conductive adhesive such as silver paste in between. With this, the heat generated by a pellet 16 is radiated not only from the back surface of the heat radiating material 10 but also from the surface of the high heat-conductive material 20 that is thermally connected to the header part 11 and the radiating performance is improved. As the surface of the resin sealing material 18 is covered with the metal sheet of the high heat conductive material 20, the humidity resistance is improved. |
