发明名称 ELECTROCONDUCTIVE PASTE
摘要 PURPOSE: To provide such electroconductive paste that is used for formation of outer electrodes of electronic parts and superior in coating shape performance by including each approximately spherical, flat, and powdery metal powder within a specific powder size range by a specific wt.% range as the electroconductive composition. CONSTITUTION: Electroconductive powder including (a) approximately spherical metal powder 50-70wt.% of grain size approximately 1-6μm, (b) flat-shape metal powder 20-50wt.% of grain size approximately 2-5μm, (c) powder-shape metal powder 5-20wt.% of grain size approximately 0.1-1μm is used as electroconductive composition of electroconductive paste. Metal powder is set to one kind which is selected out of a group consisting of Ag powder, Ag-Pd mixed powder, and Ag-Pd alloy powder. The shape performance of this electroconductive paste is improved in coating and drying by intertwining each metal powder with each another so as to perform baking without forming recesses and square projections.
申请公布号 JPH08115612(A) 申请公布日期 1996.05.07
申请号 JP19940276128 申请日期 1994.10.13
申请人 MURATA MFG CO LTD 发明人 OTANI AKIRA
分类号 H05K1/09;H01B1/00;H01B1/16;H01B1/22;H01G4/12;(IPC1-7):H01B1/16 主分类号 H05K1/09
代理机构 代理人
主权项
地址
您可能感兴趣的专利