| 摘要 |
PURPOSE: To obtain conductive particles useful to obtain an anisotropic conductive adhesive which electrically connects circuit patterns facing each other under pressure without damaging the patterns by forming conductive layers on the surfaces of specific core particles. CONSTITUTION: A conductive layer (e.g. formed by the electroless plating of gold on a layer formed by the electroless plating of nickel) is formed on the surfaces of core particles which comprise a polymer contg. repeating units derived from styrene and/or (meth)acrylic monomer (e.g. polystyrene cross-linked with divinylbenzene), have compression strengths of 4kgf/mm<2> or lower, pref. 3kgf/mm<2> or lower, at room temp. at a loading rate of 0.158gf/sec, and are nonplastically crushed when pressed under a pressure of 10-30kg/cm<2> at 120-170 deg.C for 1-10sec. Pref. the resultant conductive particles are made to have an average particle size of 2-30μm and a CV value of 20% or lower. |
