| 摘要 |
PURPOSE: To reduce cost and improve reliability and electric characteristics, by providing a resin region covering a semiconductor chip and a terminal region in which a predetermined number of columnar terminal portions and a predetermined number of frame-like terminal portions electrically connected with pads of the semiconductor chip are exposed from the resin region, in a semiconductor device. CONSTITUTION: A semiconductor device has a resin region 23 covering a semiconductor chip 41 on which a predetermined number of pads are formed, and a terminal region 24 in which a predetermined number of columnar terminal portions 28 and a predetermined number of frame-like terminal portions 27 electrically connected with the pads of the semiconductor chip 41 are exposed from the resin region 23. For instance, the terminal region 24 has an external terminal portion 26 composed of the frame-like terminal portions 27 and the columnar terminal portions 28, and a pattern portion 25 which is connected with the external terminal portion 26 and in which at least a connection portion 32b having the semiconductor chip 41 loaded thereon for electrical connection with the pad and a terminal connection portion 32a connected with the frame- like terminal portions 27 and the columnar terminal portions 28 are formed. |
