发明名称 METHOD OF FORMING AMORPHOUS SEMICONDUCTOR FILM
摘要 PURPOSE: To stably form a good amorphous semiconductor film by alternately repeating steps of depositing an amorphous semiconductor layer on a substrate and introducing H radicals into this semiconductor, using a high m. p. metal filament heat source. CONSTITUTION: SiH4 gas is introduced into a substrate 1 and power is applied between parallel flat plate electrodes to generate a SiH4 plasma 11 by which an amorphous Si:H film 10 of 2nm or less thick is formed. The SiH4 gas is then stopped and switched to H2 gas 14, and a filament 7 is heated to introduce H radicals into the film 10. The filament is made of W or Th-containing W alloy and covered with a diamond film to avoid reducing the mechanical strength. The above steps are repeated to form an amorphous semiconductor film of desired thickness.
申请公布号 JPH08115882(A) 申请公布日期 1996.05.07
申请号 JP19940253117 申请日期 1994.10.19
申请人 FUJI ELECTRIC CO LTD 发明人 SASAKI TAKAOKI
分类号 H01L21/205;H01L31/04 主分类号 H01L21/205
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